Liquid cooling heat dissipating device

ABSTRACT

The present invention discloses a liquid cooling heat dissipating device for at least one heat source. The liquid cooling heat dissipating device comprises a base, at least a cooling fin and a liquid cooling module. The device is characterized in that the cooling fin is disposed on the first area of surface of the base, and the liquid cooling module is removably installed on the first area of surface of the base. By this way, the users can optionally install the liquid cooling module according to the degrees of the generated heat. Computer suppliers can also reduce the cost effectively.

FIELD OF THE INVENTION

The present invention is related to a liquid cooling heat dissipatingdevice, particularly to a heat dissipating device which has a coolingfin and a removable liquid cooling module both.

BACKGROUND OF THE INVENTION

At present, the manufacture procedure of semiconductor and thetechnology of circuit design progress rapidly, so the efficiency ofintegrated circuit chip grows largely and the product cycle becomesshorter. When efficiency of chip becomes better or the working frequencyof chip becomes higher, the generated heat energy is larger. If the heatenergy can't be dispelled immediately for lowering the temperature ofchip to the preset extent, the efficiency of chip will be affectedsignificantly, even results in the damage of chip. Therefore, theimportance of heat dissipating device for computer system increases dayby day.

Besides, most computers are required to have expandability, users areallowed to replace better processing chip or display card chip bythemselves. Therefore, at the initial stage, user may have less demandand buy a computer with lower effects. As the demand increases, the usercan overclock the processing chip or display card chip, or directlyreplace the original chip by a higher efficiency chip. However, thehigher efficiency chip usually generates more heat energy, so users haveto install a better heat dissipating device for enabling the higherefficiency chip running in complete efficiency.

Heat dissipating devices can be approximately divided into two types,one type is passive heat dissipating device, such as a cooling fin,which doesn't need power and conducts the heat energy from the heatsource to the outside only depending on thermal convection. The othertype is active heat dissipating device, such as a fan or a liquidcooling heat dissipating device, which requires power to drive fluid,such as gas or liquid, to exchange heat with the heat source, andconducts the heat energy away from the heat source. Generally speaking,the heat dissipation effect of active heat dissipating device is betterthan that of passive heat dissipating device, and the liquid coolingheat dissipating device is further better than the fan. Therefore, mostlow level computers are only provided with passive heat dissipatingdevices and fans, and high level computers are provided with liquidcooling heat dissipating devices.

Referring to FIG. 1 for a schematic diagram of a liquid cooling heatdissipating device in prior art, the liquid cooling heat dissipatingdevice 1 comprises a liquid cooling module 11 and cooling fins 12. Theliquid cooling module 11 is disposed to cover on a chip, and locked onthe circuit board with a screw 14. The liquid coolant flows into theliquid cooling module 11 through a liquid entry channel 132 to exchangeheat and flows out from the liquid cooling module 11 through a liquidexit channel 131. The cooling fin 12 is disposed on the liquid exitchannel 131 for dissipating heat energy inside water. The liquid coolingheat dissipating device 1 can provide better dissipation function, buthas poor expandability. If the user wants to displace a higherefficiency chip, he/she has to change the entire liquid cooling heatdissipating device 1. Besides, the users can't upgrade their lower levelheat dissipating device to high level liquid cooling heat dissipatingdevice. Because of the poor expandability of the cooling fin and liquidcooling heat dissipating device, the computer suppliers have to prepareboth various liquid cooling heat dissipating devices for high levelcomputers and various cooling fins for low level computers at the sametime, the cost of preparing materials is a tremendous burden to thecomputer suppliers.

At present, the product cycle of processing chip and graphic chip becomeshorter, thus, more users have demand for changing heat dissipatingdevice. Therefore, how to provide a heat dissipating device withexpandability is an urgent problem to be solved.

SUMMARY OF THE INVENTION

Therefore, one of objects of the present invention is to provide aliquid cooling heat dissipating device to enhance the expandability andassembly convenience of the heat dissipating device.

To achieve the above-mentioned object, the present invention provides aliquid cooling heat dissipating device for at least a heat source. Theliquid cooling heat dissipating device comprises a base, at least acooling fin and a liquid module. One side of the base contacts thesurface of the heat source, and the surface of the other side of thebase has a first area and second area. The cooling fin is disposed onthe first area, and the liquid cooling module is removably installed onthe second area.

Preferably, the liquid cooling heat dissipating device further comprisesan adapter. One end of the adapter combines the liquid cooling module,and the other end combines the base, so that the liquid cooling modulecan be fixed on the second area through the adapter.

Besides, the present invention further provides a liquid cooling heatdissipating device for a first heat source and a second heat source. Theliquid cooling heat dissipating device comprises a first base, a secondbase, at least a first cooling fin, at least a second cooling fin and aliquid cooling module. One side of the first base contacts the surfaceof the first heat source, and the surface of the other side of the firstbase has a first area and second area. One side of the second basecontacts the surface of the second heat source, and the surface of theother side of the second base has a third area and fourth area. Thefirst cooling fin and the second cooling fin are respectively disposedon the first area and the third area. The liquid cooling module isremovably installed on the second area and the fourth area.

Preferably, the liquid cooling heat dissipating device further comprisestwo adapters. Two ends of the liquid cooling module are respectivelyfixed on the second area and the fourth area through the adapters.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter regarded as the invention is particularly pointed outand distinctly claimed in the concluding portion of the specification.The invention together with features and advantages thereof may best beunderstood by reference to the following detailed description with theaccompanying drawings in which:

FIG. 1 is a schematic diagram of a liquid cooling heat dissipatingdevice in prior art;

FIG. 2 is a three dimensional exploded diagram of a liquid cooling heatdissipating device of first embodiment of the present invention;

FIG. 3 is an assembling side view of a liquid cooling heat dissipatingdevice of first embodiment of the present invention;

FIG. 4 is a three dimensional exploded diagram of a liquid cooling heatdissipating device of second embodiment of the present invention;

FIG. 5 is an assembling side view of a liquid cooling heat dissipatingdevice of second embodiment of the present invention;

FIG. 6 is an assembling side view of a liquid cooling heat dissipatingdevice of third embodiment of the present invention;

FIG. 7 is an assembling side view of a liquid cooling heat dissipatingdevice of fourth embodiment of the present invention;

FIG. 8 is a three dimensional exploded diagram of a liquid cooling heatdissipating device of fifth embodiment of the present invention;

FIG. 9 is a three dimensional exploded diagram of a liquid cooling heatdissipating device of sixth embodiment of the present invention;

FIG. 10 is a schematic diagram of an application of a liquid coolingheat dissipating device of the present invention.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention are described herein inthe context of liquid cooling heat dissipating device. Those of ordinaryskilled in the art will realize that the following detailed descriptionof the exemplary embodiment(s) is illustrative only and is not intendedto be in any way limiting. Other embodiments will readily suggestthemselves to such skilled persons having the benefit of thisdisclosure. Reference will now be made in detail to implementations ofthe exemplary embodiment(s) as illustrated in the accompanying drawings.The same reference indicators will be used throughout the drawings andthe following detailed description to refer to the same or like parts.

Referring to FIG. 2 and FIG. 3 for a three dimensional exploded diagramand an assembling side view of a liquid cooling heat dissipating deviceof first embodiment of the present invention, respectively, liquidcooling heat dissipating device 2 further comprises a base 21, aplurality of cooling fins 24, an adapter 23 and a liquid cooling module22. One side of the base 21 is configured to contact with heat source ina thermally conductive manner, for example, the base 21 contacts with asurface of a chip via thermal grease. The surface of the other side ofthe base 21 has a first area 211 and a second area 212. The cooling fin24 is disposed on the first area 211. Preferably, the cooling fin 24 andthe base 21 are integrated conduction.

The second area 212 has an accommodating tank 25, in the inner wall ofwhich has a thread 251. The outer wall of the adapter 23 has a thread232 which is matched with the thread 251. Besides, the adapter 23 has anopening 25, and the inner wall of the opening 25 has a thread 231.

The liquid cooling module 22 comprises a body 220, a liquid entrychannel 221 and a liquid exit channel 222. Liquid coolant flows into theliquid entry channel 221 and the liquid exit channel 222 to exchangeheat with the body 220. One end of the body 220 has a thread 223 whichis matched with the thread 231.

While assembling, the user first plugs the liquid cooling module 22 intothe adapter 23 to make the thread 231 partially occlude the thread 223,and then disposes the adapter 23 into the accommodating tank 25 to makethe thread 232 partially occlude the thread 251. Next, the user rotatesthe adapter 23 to lock the thread 251 and the thread 232, and lock thethread 231 and the thread 223. By this way, the liquid cooling module 22can be removably installed on the second area 212, as FIG. 3illustrates.

Preferably, the base 21, the cooling fin 24, the adapter 23, and thebody 220 of the liquid cooling module 22 are made of metal having goodconduction. The base 21 can conduct the heat energy generated by theheat source to the cooling fin 24 for heat dissipation. If the liquidcooling module 22 is installed, the heat energy generated by the heatsource is conducted to the body 220 of the liquid cooling module 22through the adapter 23, and liquid coolant flows into the liquid entrychannel 221 and the liquid exit channel 222 to exchange heat with thebody 220.

Because the liquid cooling module 22 has the liquid entry channel 221and the liquid exit channel 222, the user can use the adapter 23 forassembly without rotating the liquid cooling module 22, so as to preventthe liquid entry channel 221 and the liquid exit channel 222 from beingknotted, and further facilitate the assembly.

Therefore, when the heat source is a chip having lower workingfrequency, the generated heat energy is lower, the users can remove theliquid cooling module 22 from the liquid cooling heat dissipating device2 and only the cooling fin 24 is used to dissipate heat passively tosave the energy consumption of liquid cooling dissipating device 2. Whenthe heat source is a chip having higher working frequency, the users caninstall the liquid cooling module 22 to actively dissipate heat forenabling better performance of the chip.

The location of the first area 211 and the second area 212 shown in thedrawings are for examples only, not a limitation. On the surface of thebase, the area for installing the liquid module 2 is defined as thesecond area. The area beyond the second area is defined as the firstarea. This definition is in the protective scope of the presentinvention.

Besides, the cooling fins 24 illustrated in the drawing are respectivelydisposed at two sides of the liquid cooling module 2, and face theliquid cooling module 2, and arranged in spaced-apart order. This is foran example only, not a limitation. For example, the cooling fins canalso be arranged in a sunflower shape surrounding the liquid coolingmodule 2, or other arrangement which can achieve the heat dissipatingeffects, which all are in the protective scope of the present invention.

FIG. 4 and FIG. 5 illustrate a three dimensional exploded diagram and anassembling side view of second embodiment of the liquid cooling heatdissipating device of the present invention respectively. Thedifferences between the liquid cooling heat dissipating device 3 andliquid cooling heat dissipating device 2 are that the adapter 33 has awedge 331, and one side of the liquid cooling module 32 has a protrudededge 323 which is matched with the wedge 331.

While assembling, the user can lock the adapter 33 on the accommodatingtank 25 first, and then push the wedge 331 aside, and dispose theprotruded edge 323 of the liquid cooling module 32 into the spacesurrounded by the wedge 331, and then release the wedge 331. The wedge331 leans tightly against the body 220 due to the flexibility of thematerial of the wedge 331, and wedges the protruded edge 323 to fix theliquid cooling module 32, as shown in FIG. 5. By This way, the heatenergy generated by the heat source can be conducted from the base 21 tothe adapter 33, and then further conducted to the liquid cooling module32.

FIG. 6 illustrates an assembling side view of third embodiment of theliquid cooling heat dissipating device of the present invention. Whenheat dissipation for a plurality of heat source is required, a largerbase can be used. One side of a base 41 of liquid cooling heatdissipating device 4 covers chips 491˜495, and the other side of thebase 41 has a cooling fin 24 and a liquid cooling module 22. The userscan remove the liquid cooling module 22 or install the liquid coolingmodule 22 on the base 41 according to their demand. The liquid coolingheat dissipating device 4 can be fixed on a circuit board 496 by usingscrew or tenon. For example, when a processing chip and a graphic chipare installed on main board, the liquid cooling heat dissipating device4 of the present invention can used to dissipate the heat generated bythe processing chip and the graphic chip. By using the liquid coolingheat dissipating device of the present invention and selecting theliquid cooling module 22 corresponding to bases of various sizes, theproblem of dissipate the heat of one heat source or a plurality of heatsources can be solved and the required cost is reduced.

FIG. 7 illustrates an assembling side view of fourth embodiment of theliquid cooling heat dissipating device of the present invention. Theliquid cooling heat dissipating device 5 is used to dissipate the heatof two heat source facing each other. The cooling heat sink 5 comprisesa base 21, a base 51, a cooling fin 24, a cooling fin 54, an adapter 23,an adapter 53, and a liquid cooling module 22. One side of the base 21contacts the surface of a heat source 582, and a surface of the otherside of the base 21 has a first area 211 and a second area 212. Thecooling fin 24 is disposed on the first area 211. One side of the base51 contacts the surface of a heat source 592, and a surface of the otherside of the base 51 has a third area 511 and a fourth area 512. Thecooling fin 54 is disposed on the third area 511. Preferably, thecooling fin 24 and the base 21, the cooling fin 54 and the base 51 areintegrated conduction.

The second area 212 and the fourth area 512 respectively have anaccommodating tank to accommodate the adapter 23 and the adapter 53. Thecombination manner between the accommodating tank and the adapter, andthe combination manner between the liquid cooling module and the adapterare the same as the said embodiments. So, the details are no longerdescribed. When the user installs two display cards in computer, theycan use the liquid cooling heat dissipating device 5 to dissipate theheat generated by two graphic chips at the same time.

The liquid entry channel 221 and the liquid exit channel 222 of theliquid cooling module 22 are disposed at sides of the body 22. Thelayout of the liquid entry channel 221, the liquid exit channel 222, thecooling fin 24 and the cooling fin 54 shown in FIG. 6 is just anexample, not a limitation. All layouts which can allow the liquidcooling module 22 to be removed from the base are within the protectivescope of the present invention.

Besides, the above-mentioned combination manner for the accommodatingtank and the adapter is just an example, not a limitation. Any mechanismcapable of stably combining is within the protective scope of thepresent invention, for example, the mechanisms shown in FIG. 8 and FIG.9. In FIG. 8, the differences between the liquid cooling heatdissipating device 6 and other embodiments are that the second area 212on the base 61 has a protrusion 65, and the outer wall of the protrusion65 has a thread 651, and two sides of the inner wall of the opening ofthe adapter 63 respectively has a thread 231 and a thread 632. Thethread 632 is matched with the thread 651. While assembling, the userscan first plug the liquid module 22 into the adapter 63 to partiallyocclude the thread 231 and the thread 223, and plug the protrusion 65onto the adapter 63 to partially occlude the thread 651 and the thread632. Next, the user can rotate the adapter 63 to lock the thread 231 andthe thread 223 tightly and lock the thread 651 and the thread 632tightly. By this way, the liquid cooling module 22 can be tightly fixedon the second area 212 through the adapter 63.

In FIG. 9, the differences between the liquid cooling heat dissipatingdevice 7 and other embodiments are that the second area 212 on the base71 has a plurality of protruded posts 75, and these protruded posts 75are arranged in a ring-like shape, and their sides faced to the innerring-like shaped center have threads 751. The outer wall of the adapter73 has a thread 732 which is matched with the thread 751. Thecombination manner of the adapter 73 and the protruded posts 75 is thesame as the embodiments.

Besides, the thread 751 can be disposed the outer sides of protrudedposts 75, which are corresponding to center of the ring-like shape, andcorrespondingly, the thread 732 is disposed on the inner wall of theopening of the adapter 73.

FIG. 10 illustrates a schematic diagram of an application of the liquidcooling heat dissipating device of the present invention. The processingchip and graphic chip of a computer system 8 need heat dissipation. Theusers can respectively install the liquid cooling heat dissipatingdevice 81 and the liquid cooling heat dissipating device 82 of thepresent invention on the processing chip and graphic chip, and thentandem connect the channel 841˜843 of the liquid module to a wateroutlet and a water inlet of a pump 83 respectively. The pump 83 drivesthe liquid in the channel 841˜843 to cycle constantly, so that theliquid can absorb and take away the heat energy generated by theprocessing chip and graphic chip.

The liquid cooling module of the liquid cooling heat dissipating deviceof the present invention is removably attached on the base, for example,the means of locking or wedging described in the above embodiments, thisis different from the liquid cooling module of the traditional liquidcooling heat dissipating device which is immobily fixed on the base.Therefore, the liquid cooling heat dissipating device of the presentinvention can provide better expandability and better control of thecost of preparing materials.

At present, most personal computers have expandability, so the user canchange processing chip or display card having better effects byhimself/herself. Therefore, at the initial stage the users buy acomputer system having lower effects, the heat energy generated by thechip of system is lower, so users can just install the base of thepresent invention on the chip first, and cooling fin is enough todissipate the heat energy generated by the chip. Later, if the userwants to upgrade the original chip to a chip having higher workingefficiency and better performance, and only cooling fin is not enough todissipate the heat energy generated by the upgraded chip, the user canfurther install the liquid cooling module on the base to fulfill theheat dissipation required by the upgraded chip. This means that liquidcooling heat dissipating device of the present invention hassignificantly great expandability.

Besides, for computer manufacturers, the liquid cooling heat dissipatingdevice of the present invention also can reduce the stock costs of theelements. By using the liquid cooling heat dissipating device of thepresent invention, when computer manufacturers want to produce low classcomputers and high class computers, they don't have to preparedissipating device for low class computers and high class computersrespectively. Suppliers can install bases which have cooling fins in allcomputers. If high class computer is to be delivered, they can furtherinstall the liquid cooling module. This can reduce the cost forpreparing materials and enhances the flexibility of preparing materials.

It should be noted that liquid cooling modules are attached on the basesthrough the adapters in the embodiments, but this is not a limitation.Though using the adapters can facilitate the installation, but theobjective of removably installing the liquid cooling module on the basewithout using the adapter can also be achieved. The combination mannerbetween the liquid module and the base can further comprises threadlocking, wedging or other joint manners which can tightly joint twoobjects and the jointed objects can also be separated. If the liquidcooling heat dissipating device comprises the adapter, then thecombination manner between the liquid module and the adapter, or betweenthe adapter and the base, can comprise thread locking, wedging or otherjoint manners which can be tightly joint two objects and these jointedobject can also be separated.

While the invention has been described by way of example and in terms ofa preferred embodiment, it is to be understood that the invention is notlimited thereto. To the contrary, it is intended to cover variousmodifications and similar arrangements and procedures, and the scope ofthe appended claims therefore should be accorded the broadestinterpretation so as to encompass all such modifications and similararrangements and procedures.

1. A liquid cooling heat dissipating device for dissipating heat from aheat source within a chassis of a computer system, said devicecomprising: a base comprising thermally conductive material, whereinsaid base has an exterior surface with a first area, a second area, anda third area, and wherein said first area is configured to contact withsaid heat source in a thermally conductive manner; at least one coolingfin disposed on said second area; and a liquid cooling module removablyattached on said third area.
 2. The liquid cooling heat dissipatingdevice of claim 1, further comprising an adapter, and one end of saidadapter for combining with the liquid cooling module, and the other endof said adapter for combining with the base, so that the liquid coolingmodule can be fixed on said third area through the adapter.
 3. Theliquid cooling heat dissipating device of claim 1, wherein said thirdarea has an accommodating tank, a protrusion or a plurality of protrudedposts.
 4. The liquid cooling heat dissipating device of claim 3, whereinthe inner wall of said accommodating tank has a first thread, and theouter wall of said adapter has a second thread, and said adapter isfixed on the base by locking and joining said first thread and saidsecond thread.
 5. The liquid cooling heat dissipating device of claim 3,wherein the outer wall of said protrusion has a first thread, and saidadapter has an opening, and at two ends of the inner wall of the openingrespectively have a second thread, and said adapter is fixed on the baseby locking and joining said first thread and said second thread.
 6. Theliquid cooling heat dissipating device of claim 3, wherein saidprotrusion is ring-shaped, and the inner wall of said protrusion has afirst thread, the outer wall of said adapter has a second thread, andsaid adapter is fixed on said base by locking and joining said firstthread and said second thread.
 7. The liquid cooling heat dissipatingdevice of claim 3, wherein said protruded posts are arranged in aring-like shape, and one side faced to the inner ring-shaped center ofsaid protruded post has a first thread, the outer wall of said adapterhas a second thread, and said adapter is fixed on the base by lockingand joining said first thread and said second thread.
 8. The liquidcooling heat dissipating device of claim 2, wherein said adapter has anopening, and the inner wall of said opening has a third thread, and oneend of said liquid cooling module has a fourth thread, and said liquidcooling module is joined with the adapter by locking and joining saidthird thread and said fourth thread.
 9. The liquid cooling heatdissipating device of claim 2, wherein one end of the adapter has awedge structure, and one end of the liquid cooling module has aprotruded edge, so that said liquid cooling module is joined with theadapter by wedging said protruded edge with said wedge structure. 10.The liquid cooling heat dissipating device of claim 1, wherein theliquid cooling module comprises a body, a liquid entry channel and aliquid exit channel, and the liquid coolant flows into said liquid entrychannel and said liquid exit channel to exchange heat with said body.11. A liquid cooling heat dissipating device for dissipating heat from afirst heat source and a second heat source within a chassis of acomputer system, said device comprising: a first base comprisingthermally conductive material, wherein said first base has an exteriorsurface with a first area, a second area, and a third area, and whereinsaid first area is configured to contact with said first heat source ina first thermally conductive manner; a second base, comprising thermallyconductive material, wherein said second base has an exterior surfacewith a fourth area, a fifth area, and a sixth area, and wherein saidfourth area is configured to contact with said second heat source insecond thermally conductive manner; at least one first cooling findisposed on the second area; at least one second cooling fin disposed onthe fifth area; and a liquid cooling module removably attached on thethird area and the sixth area.
 12. The liquid cooling heat dissipatingdevice of claim 11, further comprising two adapters, and two ends ofsaid liquid cooling module respectively fixed on the third area and thesixth area.
 13. The liquid cooling heat dissipating device of claim 12,wherein the third area or the sixth area has an accommodating tank, aprotrusion or a plurality of protruded posts.
 14. The liquid coolingheat dissipating device of claim 13, wherein the inner wall of saidaccommodating tank has a first thread, and the outer wall of saidadapter has a second thread, and said adapter is fixed on said base bylocking and joining said first thread and said second thread.
 15. Theliquid cooling heat dissipating device of claim 13, wherein the outerwall of said protrusion has a first thread, and said adapter has anopening, and two ends of the inner wall of the opening respectively havea second thread and said adapter is fixed on the base by locking andjoining said first thread and said second thread.
 16. The liquid coolingheat dissipating device of claim 13, wherein said protrusion isring-shaped, the inner wall of said protrusion has a first thread, andthe outer wall of said adapter has a second thread, and said adapter isfixed on said base by locking and joining said first thread and saidsecond thread.
 17. The liquid cooling heat dissipating device of claim13, wherein said protruded post are arranged in a ring-like shape, andone side faced to the inner ring-shaped center of said protruded posthas a first thread, the outer wall of said adapter has a second thread,and said adapter is fixed on said base by locking and joining said firstthread and said second thread.
 18. The liquid cooling heat dissipatingdevice of claim 12, wherein said adapter has an opening, the inner wallof said opening has a third thread, and one end of said liquid coolingmodule has a fourth thread, and said liquid cooling module is joinedwith said adapter by locking and joining said third thread and saidfourth thread.
 19. The liquid cooling heat dissipating device of claim12, wherein one end of said adapter has a wedge structure, and one endof said liquid cooling module has a protruded edge, so that said liquidcooling module is joined with said adapter by wedging said protrudededge with the wedge structure.
 20. The liquid cooling heat dissipatingdevice of claim 11, wherein said liquid cooling module comprises a body,a liquid entry channel and a liquid exit channel, and liquid coolantflows into said liquid entry channel and said liquid exit channel toexchange heat with said body.
 21. A liquid cooling heat dissipatingdevice for dissipating heat from a heat source within a chassis of acomputer system, said device comprising: a base comprising thermallyconductive material, wherein said base has an exterior surface with afirst area, a second area, and a third area, and wherein said first areais configured to contact with said heat source in a thermally conductivemanner; at least one cooling fin disposed on said second area; and meansfor removably attaching a liquid cooling module to said third area. 22.The liquid cooling heat dissipating device of claim 21, wherein saidmeans comprises an adapter, and one end of said adapter for combiningwith the liquid cooling module, and the other end of said adapter forcombining with the base.
 23. The liquid cooling heat dissipating deviceof claim 22, wherein said third area has an accommodating tank, aprotrusion or a plurality of protruded posts.
 24. The liquid coolingheat dissipating device of claim 23, wherein the inner wall of saidaccommodating tank has a first thread, and the outer wall of saidadapter has a second thread, and said adapter is fixed on the base bylocking and joining said first thread and said second thread.
 25. Amethod for dissipating heat from a heat source within a chassis of acomputer system, said method comprising: removably attaching a liquidcooling module to a base comprising thermally conductive material,wherein said base has an exterior surface and at least one cooling findisposed on a first area of said exterior surface, and wherein a secondarea of said exterior surface is connected in a thermally conductivemanner to a heat source within said chassis; and flowing liquid coolantinto said liquid cooling module to conduct heat from said base.
 26. Themethod of the claim 25, wherein said liquid cooling module is attachedto said base by an adapter.
 27. The method of the claim 26, wherein saidbase has an accommodating tank, a protrusion or a plurality of protrudedposts on said exterior surface for attaching said adapter.
 28. Themethod of the claim 27, wherein the inner wall of said accommodatingtank has a first thread, and the outer wall of said adapter has a secondthread, and said adapter is fixed on the base by locking and joiningsaid first thread and said second thread.